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Dielectric properties of AIN/polymer composites for electronic substrate application
文献类型:会议
作者:Zhang, Jie[1]  Fan, Huiqing[2]  Ke, Shaming[3]  Shi, Yunze[4]  Zeng, Xianhua[5]  Bi, Meitian[6]  Huang, Haitao[7]  
机构:Northwestern Polytech Univ, State Key Lab Solidificat Proc, Sch Mat Sci & Engn, Xian 710072, Peoples R China.
年:2007
通讯作者:Zhang, J (reprint author), Northwestern Polytech Univ, State Key Lab Solidificat Proc, Sch Mat Sci & Engn, Xian 710072, Peoples R China.
会议名称:ADVANCES IN COMPOSITE MATERIALS AND STRUCTURES, PTS 1 AND 2
页码范围:1053-1056
收录情况:CPCI-S(WOS:000245033100264)  
所属部门:材料学院
人气指数:808
浏览次数:795
被引频次:3
语言:外文
关键词:epoxy reins; substrate material; thermal conductivity; dielectric property
摘要:
The fabrication processing, dielectric properties and thermal properties of polymer-matrix composites containing AlN particles (10 mu m) for electronic substrates and microelectronic packaging applications were investigated. The epoxy resin (E-51) is used as the matrix, and the dispersion of the AlN in the composites is varied form 0 vol% to 40 vol%. The microstructures of the polymer-matrix composites are observed through scanning electron microscopy (SEM). With increasing the AlN content, ther ...More
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